Ceramic heating control board PCBA

1. Layers:  Single Sided,2 to 18 Layer

2. Board material type:  FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more

3. Compound material lamination:  4 to 6 layers

4. Maximum dimension: 610 x 1,100mm

5. Dimension tolerance: ±0.13mm

6. Board thickness coverage: 0.2 to 6.00mm

7. Board thickness tolerance:  ±10%

8. DK thickness:  0.076 to 6.00mm

9. Minimum line width:  0.10mm

10. Minimum line space:  0.10mm

11. Outer layer copper thickness: 8.75 to 175µm

12. Inner layer copper thickness: 17.5 to 175µm

13. Drilling hole diameter (mechanical drill): 0.25 to 6.00mm

14. Finished hole diameter (mechanical drill): 0.20 to 6.00mm

15. Hole diameter tolerance (mechanical drill): 0.05mm

16. Hole position tolerance (mechanical drill): 0.075mm

17. Laser drill hole size: 0.10mm

18. Board thickness and hole diameter ratio: 10:1

19. Solder mask type: Green, Yellow, Black, Purple, Blue, White and Red

20. Minimum solder mask: Ø0.10mm

21. Minimum size of solder mask separation ring: 0.05mm

22. Solder mask oil plug hole diameter: 0.25 to 0.60mm

23. Impedance control tolerance: ±10%

24.Surface finish: Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger

Ceramic heating control board PCBA

According to the temperature change of the working environment, the physical deformation occurs in the switch, which produces some special effects, and produces a series of automatic control elements for the on-off or on-off action

Ceramic heating control board PCBA production process:

1. Driil

2. PTH line

3. Image transfer

4. Cu Tin plated

5. Etching

6. Soldermask

7. Silkscreen

8. Surface finish

9. Routing

10. Testing

11. Packing

Ceramic heating control board electronic pcb assembly

Adjustable temperature, fast response control.

Ceramic heating control board PCBA product advantage

High heating capacity, high efficiency.