Product Name:Communication Class High Multilayer Back Circuit Board
Description
|
Model
|
BAT051
|
|
Number of layers
|
28L
|
|
Thickness
|
6.5mm
|
|
Minimum aperture
|
0.7mm
|
|
Minimum line width/line spacing
|
0.1mm
|
|
Inner copper thickness
|
1OZ
|
|
Outer copper thickness
|
TOZ+
|
|
Surface treatment
|
Gold ENIG
|
|
Hole to line minimum distance
|
0.18mm
|
Application
In the next five years, driven by data processing centers, packaging substrates and multilayer boards will grow rapidly.
