Engineering AlN Ceramic Substrate Insulators for Packaging
Product Description:
Aluminum nitride ceramics are often used in electronic packaging, power electronics and high temperature applications such as furnace components and aerospace applications. the high thermal conductivity of AlN ceramics allows them to dissipate heat efficiently and protect sensitive electronic components from thermal damage.
Our Service:
Please contact us for customization.
Specification:
| Dimension(LxW) |
114.3 mm x 114.3 mm |
| Thickness |
0.38/0.5 mm |
| Thermal Conductivity |
170-230W/m.K |
| Dielectric Constant |
8-9 (MHz) |
| Bulk Density |
3.3 g/cm³ |
| Surface Roughness |
Ra < 0.6 μm on both sides |
Company Advantage:
Huaqing Founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop&Equipment:
Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc.
