High Frequency Microwave Copper Substrate PCB High End

AUREOLA BAG013 High Frequency Microwave Copper Substrate PCB High End .Main applications:satellite communications, communication equipment adapters, receivers, signal oscillators, home appliance networking,etc.



Product Name:High Frequency Microwave Copper Substrate Circuit Board


Description

Model BAG013
Number of layers 4L+Copper base
Thickness 5.6mm
Minimum aperture 0.35mm
Minimum line width/line spacing 1.25mm
Inner copper thickness HOZ
Outer copper thickness 1OZ
Surface treatment Gold ENIG
Hole to line minimum distance 0.185mm

Application

Widely used in communication and computer fields,such as high-frequency communication, high-speed transmission, high confidentiality, high transmission quality, and high memory capacity processing.

                                     High End Circuit Board Copper Substrate

                                          


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