HTC Diamond Grinding Pad for Concrete Metal Bond Scraper Pad

HTC Diamond Grinding Pad for Concrete can remove the epoxy adhesive on the concrete floor very aggressively. HTC Metal Bond Scraper Pad can level the surface of granite, marble and other stone materials



Product Item: HTC Diamond Grinding Pad for Concrete Metal Bond Scraper Pad


Description: 


Diamond Grinding Pad is used to grind the concrete floor. Dialead have grit No ranging from 16# to 400#.

For 16#/20#, it is used to remove hard epoxy and other attached materials on the concrete floor,

For 30#/40#, it is used to roughly grind. For 60#/80#, it is used to medium grind. For 120# and the above, it is for fine grind.

Dialead have produced many different shapes of segments on the pad to suit different machines. for grinding pad with 2 segments or above, usually it is used for heavy machine. for grinding pad with 1 segments only, it is for light machine and usualy for aggressive stock removal.

Description Code Grit NO Application

Fan-Shaped Diamond floor Pad


DFP-001

16#/20#/30#/50#/60#80#/100#/120#/150#/200#/300#/400#


Concrete/Marble/Granite Floor




Features:


1, High Sharpness and Long life.

2, Different Shapes can be produced.

3, Remove the materials very aggressively.



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Product Tags stone profiling tools          stone profiles          profile stone          stone profile          profiling tools          rolling stone profiles          stone coping profiles          stone moulding profiles          stone risk profile         

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