Brief introduction:
This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.
Detailed specification:
|
Model
|
Unit
|
JL-13 B7
|
|
Plate size
|
mm
|
1053*530*45
|
Min.workpiece thickness
|
mm
|
0.4
|
|
Number of carriers
|
piece
|
7
|
|
Max. Workpiece diameter
|
mm
|
Φ280
|
Lower plate rotational speed
|
rpm
|
2-45(Stepless change speed)
|
Machined work piece precision
|
|
The parallelism is 0.005 when the parallelism of the incoming material is 0.005, the surface roughness is not more than Ra0.15μm, the polishing piece Ra0.125μm
|
|
Main motor power
|
|
380V/15Kw/1450rpm
|
|
Lower plate run out
|
mm
|
≤ 0.05
|
Correction wheel correction parallelism
|
mm
|
≤ 0.005
|
Overall dimension
|
mm
|
1800*1400*2680
|
Machine weight
|
KG
|
3200
|
Delivery:
The delivery depends on different machines with different configurations. In about 60 days.
Payment:
We prefer to do 100% T/T (30% T/T in advance, 70% T/T before shipment)
Warranty:
The warranty period is general 13 months after B/L date. During the warranty period, we will provide free replacement parts (EXW) which are caused by machine itself quality problems. Meanwhile, the machine should be under normal operation according to Operation Manual.(Except for improper operation or man-made damaged by buyers)
Agents Wanted:
We have partnerships in Europe, America, South America, India, Southeast Asia and South Africa. We also supply OEM service, and we are looking for agents in these areas. Wherever you are from, we are looking forward to explore new market with you.
