Specification of tungsten copper alloy nano:

Particle:<100nm, 75um

Note: We can supply different size products of tungsten copper alloy nano according to client's requirements.

Tungsten-copper alloy combines the advantages of tungsten and copper. The melting point of tungsten is high (the melting point of tungsten is 3410 ° C, the melting point of copper is 1080 ° C), and the density is high (tungsten density is 19.34 g/cm3, copper density is 8.89 g/cm3). Copper has excellent electrical and thermal conductivity. Tungsten-copper alloy (commonly composed of WCu7~WCu50) has uniform microstructure, high temperature resistance, high strength, arc erosion resistance and high density. It has moderate conductivity and thermal conductivity and is widely used in military high temperature resistant materials. , high-voltage switch with electrical alloys, electrical processing electrodes, microelectronic materials, as parts and components are widely used in aerospace, aviation, electronics, electricity, metallurgy, machinery, sports equipment and other industries.

Application of tungsten copper alloy nano:

1. military high temperature resistant materials
2.the electrical alloy for high voltage switch
3. electric processing electrode
4.microelectronic materials

Storage conditions:
tungsten copper alloy nano should be sealed and stored in a dry and cool environment. It should not be exposed to the air for a long time, to prevent agglomeration due to moisture, affecting the dispersion performance and use effect, and should avoid heavy pressure, do not contact with oxidant, and transport according to ordinary goods.