Polyamide Hot-melt Adhesive for Electronic

polyamide hot-melt adhesive has high bonding strength, good suppleness, high temperature resistance and good media resistance.


  • Packing25kg bag
  • Coloryellowish
  • Appearance granular transparent solid

Performance:

yellowish granular transparent solid. Non-toxic, no stimulation, can be soluble in most organic solvents, non-soluble in water.


Application:

polyamide hot-melt adhesive can be used as adhesive for garments, shoes, leather and electric products seal etc. It is also be used as hot-melt bonding material.     


Specification:

Item SM-002  
Acid value (mgKOH/g)  5
Amine value (mgKOH/g)  5
Viscosity (mpa.s/200οC)      2500-4500     
Softening point (οC) 105-115
Color (Fe-Co)  8
Shear strength (mpa)  7
Elongation (mpa)  400
Water absorption (%)  0.4
Temperature(οC)

140-160


Packaging:

double layer packing, the outer packing is three-in-one kraft bag and the inner packing is polyethylene plastic bag. Net weight 25kg/bag.
Storage: store in a cool and dry place. 

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