RESIN BOND POLISHING PAD FOR CERAMIC DIA.100MM

DESCRPITION:

This resin bond polishing pad is specialized designed for polishing ceramic. Grits from 50# to 3000# are available.

SPECIFICATIONS:

Material: Resin + Diamond powder

Type: polishing pad

Available diameter: 4”(100mm)

Available grits: 50# 100# 200# 400# 800# 1500# 3000#

Working thickness: 5mm

Connection: Hook and Loop

Application: for polishing ceramic

Machine: Angle grinder