Product Name:Special Third Order Gold Finger Circuit Board
Description
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Model
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BAT047
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|
Number of layers
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10L
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|
Thickness
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1.0mm
|
|
Minimum aperture
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0.1mm
|
|
Minimum line width/line spacing
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0.075mm/0.075mm
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|
Inner copper thickness
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35μm
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|
Outer copper thickness
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35μm
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|
Surface treatment
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Gold + Gold finger + Hypotenuse ENIG+OSP+Beveling of G/F
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|
Hole to line minimum distance
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0.16mm
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Application
In the middle and late stages of 5G construction, with the accelerated penetration of 5G high-bandwidth business applications, such as mobile high-definition video, Internet of Vehicles, AR/VR and other business applications, the demand for high-speed multilayer boards in the field of data communications will grow rapidly.
