Product Name:Communication Through Hole Circuit Board
Description
|
Model
|
BAT053
|
|
Number of layers
|
8L
|
|
Thickness
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1.20mm
|
|
Minimum aperture
|
0.25mm
|
|
Minimum line width/line spacing
|
0.081/0.127mm
|
|
Inner copper thickness
|
H/H
|
|
Outer copper thickness
|
15-33μm
|
|
Surface treatment
|
Gold ENIG+OSP
|
|
Hole to line minimum distance
|
/
|
Application
High-end communication PCB, the cornerstone of new technology infrastructure. As the starting point of this round of technological innovation, 5G infrastructure is the main line, and the demand for base stations and servers has increased.
