Flexible
PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener
(FPC’s
are custom-made products, the picture and parameters shown are just for
reference)
General
description:
The base laminate is from Shengyi, It’s
fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting head.
Parameter
and data sheet:
|
Size of
Flexible PCB
|
230.5 X
40.8mm
|
|
Number of Layers
|
1
|
|
Board Type
|
Flexible PCB
|
|
Board Thickness
|
0.20mm
|
|
Board Material
|
Polyimide
(PI) 25µm
|
|
Board Material Supplier
|
ITEQ
|
|
Tg Value of Board Material
|
60℃
|
|
|
|
PTH Cu thickness
|
≥20 µm
|
|
Inner Iayer Cu thicknes
|
N/A
|
|
Surface Cu thickness
|
35µm (1oz)
|
|
|
|
Coverlay Colour
|
Yellow
|
|
Number of Coverlay
|
1
|
|
Thickness of Coverlay
|
25
µm
|
|
Stiffener Material
|
Polyimide
|
|
Stiffener Thickness
|
0.2mm
|
|
|
|
Type of Silkscreen Ink
|
IJR-4000
MW300
|
|
Supplier of Silkscreen
|
TAIYO
|
|
Color of Silkscreen
|
White
|
|
Number of Silkscreen
|
1
|
|
|
|
Peeling test of Coverlay
|
No
peelable
|
|
Legend Adhesion
|
3M 90℃No
peeling after Min. 3 times test
|
|
|
|
Surface Finish
|
Immersion
Gold
|
|
Thickness of Nickle/Gold
|
Au:
0.03µm(Min.); Ni 2-4µm
|
|
RoHS Required
|
Yes
|
|
Famability
|
94-V0
|
|
|
|
Thermal Shock Test
|
Pass, -25℃±125℃, 1000 cycles.
|
|
Thermal Stress
|
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
|
|
Function
|
100%
Pass electrical test
|
|
Workmanship
|
Compliance
with IPC-A-600H & IPC-6013C Class 2
|
Features
and benefits:
Excellent
flexibility
Reducing
the volume
Weight
reduction
Consistency
of assembly
Increased
reliability
Low
cost
Continuity
of processing
Focus
on low to medium volume production
More
than 18 years of experience
Applications:
Mobile
phone built-in antenna FPC, flex keyboard for mobile phone keys, Industrial
control computer soft board
Stiffener:
In
many applications where there are components soldered, the flexible boards require
external stiffeners (Stiffener, also known as the reinforcing board) for
external support. The stiffener materials are PI or Polyester film, glass
fiber, polymer materials, steel foil, aluminum shim and so on.
(1)PI
or Polyester
PI
and polyester films are commonly used stiffener materials for flexible circuit
board. The commonly used thickness is 125μm (5mil), some hardness can be
obtained.
(2)Glass
fibers
Glass
fibers (such as FR-4), which are also commonly used materials for stiffeners.
The fiber glass stiffener has a higher hardness than that of PI or Polyester,
used where the requirements of harness is higher. The thickness range is
typically 125μm (5mil) to 3.175mm (125mils). However, its processing is
relatively difficult than PI, and may not be a standing material for some FPC
factories.
(3)Polymer
Polymer,
such as plastic, etc. is also used as stiffeners.
Its
water absorption is low, with high pressure and high temperature resistance.
(4)Steel
foil, aluminum shim
The support
hardness of steel foil, aluminum shim is high, the heat can also be dissipated.
The hardness or heat dissipation in the design is the main concern.
More
Displays of PI Stiffener:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
