High phosphorus EN plating chemicals(MX-EN604 )

MX-EN604 plating with good stability, good salt spray test results, and phosphorus content more than 10.1, plating rate about 8-10um/h.



MX-HP6(high phosphorus) high anti-corrosion Ni-P alloy Electroless Plating Concentrated Solution


Product Introduction

MX-HP6 seriesis our company cross-century 6th generation product, not only by the introduction of foreign advanced formula, but also by a large number of experiments practice. The plating solution made up by our product has good stability, low porosity, corrosion resistance and stand resistance. So it is suitable for coal mine machinery, petroleum machinery, chemical equipment, electronic communications, aerospace and other products on anti-corrosion, abrasion resistant. 

Product Features

1. Without DC, plating process can be completed only by chemical reactions, low energy consumption;

2. Less investment in equipment, less occupying space, less members required;

3. Contain no cyanide, hexavalent chromium, lead, mercury and other toxic materials, friendly-environmental;

4. With good stability, long life cycle , the plating solution usually can reach 8-10 cycles;

5. Low porosity, strong corrosion resistance;

6. Good coherence, good impacting resistance,the binding force of middle-low carbon steel can be up to 350-450MPa, the result of bending test could be non-scaling;

7. Higher hardness, plated hardness can up to 500-550HV; after keeping 400 ℃ for 1 hour, hardness can up to 1000HV;

8. Without the impact of electricity, the plating has good uniformity, proper size to control and no longer need reprocess after the plating;

9. Plating rate is about 8-12um/h,,cladding appear stainless steel color(silver), glossiness can keep good consistency in the using cycle;

10. The coating is not magnetic, electromagnetic shielding is good.

11. Direction for Use

Concentration component

Number

Name

Application

MX-HP6A-N-P

Nickel electroless plating additive A

basic solution and replenish

MX-HP6B-N-P 

Nickel electroless plating additive B

basic solution

MX-HP6C-N-P

Nickel electroless plating additive C

replenish


Proportion of basic solution

Concentrate Solution A50mL/L, Concentrate Solution B120mL/L

Proportion of supplement

Concentrate Solution A:Concentrate Solution C=1:1(volume)


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