Hybrid High Frequency Multilayer PCB 6-Layer 12mil RO4003C and FR-4

The 12mil core is on the top layer and it mainly plays the roles of signal layer. The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board.

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Description

Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

The type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.

Stackup 6L 12mil RO4003C+FR4

Viewing from the stack-up, the rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.

The detailed specifications are as follows:

Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4

Dielectric constant: 3.38+/-0.05

Layer count: 6 layers

Via type: Through holes

Format: 105mm x 80mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm / Inner layer 18μm

Solder mask / Legend: Green / White

Final PCB height: 1.4 mm

Others: Impedance controlled PCB

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

12mil RO4003C+FR4 PCB

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

Appendix: Our PCB Capability 2021:

Parameter	Value
Layer Counts	1-32
Substrate Material	FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger