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Input Power
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1, Single phase 108V-220 VAC 50 / 60 Hz
2, 2000 W (including vacuum pump and water chiller)
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Source Power
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Two sputtering power sources are integrated into one control box
a, DC source: 500 W power for coating metallic materials ;
b, RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials.
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Magnetron Sputtering Head
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1, Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included
2, One Sputting Head Model also available in this product page (in product options)
a, One is connected to DC source for coating metallic materials
b, The other one is connected to RF source for non-conductive materials
c, Target size requirement: 2" diameter
d, Thickness range: 0.1 - 5 mm for both metallic and non-conductive targets (including backing plate)
e, One Stainless Steel Target target and one Research Grade Al2O3 target are included for demo testing
f, Optional 2" sputtering targets (or backing plate) are available upon request at extra cost.
g, Recommended Sputtering Recipe and Useful Tips
3, Customized coater: Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request
4, Optional: 148 cm RF cable can be ordered at extra cost for replacement (Click the 1st pic from right to order)
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Vacuum Chamber
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1, Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
2, Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
3, Hinged type lid with pneumatic power pole allows easy target change
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Sample Stage
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1, Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
2, Sample holder size: 140 mm Dia. for. 4" wafer max
3, Rotation speed: 1 - 20 rpm adjustable for uniform coating
4, The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller
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Gas Flow Control
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1, Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses
*Flow rate: 0 – 200 mL/min adjustable on the touch screen control panel
2, Air inlet valve is installed for vacuum release
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Vacuum Pump Station
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1, A mobile pump station is included. The sputtering coater can be placed on top of station
2, High-speed turbo pump at speed 80L/S is combined with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
3, Standard vacuum level connected with chamber : < 4.0E-5 Torr. . (1.0E-6 Torr with chamber baking )
4, Optional at extra cost
5, If choose a 150L/S high speed turbo pump, vacuum can reach 10-6 torr with chamber ( 6x10-7 torr with baking)
6, For the ultra-high vacuum upto 10^-7 torr, a getter pump (100L/s H2 & O2) is needed in addition to the turbo pump. Please consult our engineers for detailed customization.
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Water Chiller
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One digital temperature controlled recirculating water chiller is included. (Click picture to see details)
1, Refrigeration range: 5~35 °C
2, Flow rate: 16 L/min
3, Pump pressure: 14 psi
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Optional
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1, Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å
2, Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is available at extra cost
3, Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered
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Net Weight of Coater
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160kg
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Application Notes
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1, A two-stage pressure regulator (not included) should be installed on gas cylinder to limit the gas output pressure below 0.02 MPa for safe usage
2, In order to remove oxygen from the chamber, MTI suggest you to use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times, which can reduce oxygen level to < 10 ppm
3, Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O depending on the supplier. MTI suggest you to use gas purification device to purify gas before filling in.
4, For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding
5, OLT supplies single crystal substrate from A to Z
6, OLT Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C
7, Test the flexibility of the thin film / coated electrode with EQ-MBT-12-LD mandrel bending tester.
8, HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
9, DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water
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