PTFE High Frequency PCB 1.5mm DK 2.65 PTFE RF
Circuit Board with 3oz Copper Coating Immersion Gold
PTFE high frequency PCB widely applied to radar, navigation, satellite
communication, 4G communications, 5G communications and the like.
PCB Specifications:
|
Layer count:
|
Double sided
|
|
Base material:
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F4B DK 2.65
|
|
Dimension:
|
210 x 115mm
|
|
Finished
thickness
|
1.6mm ±10%
|
|
Finished Copper
weight:
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3oz
|
|
SMOBC:
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No
|
|
Surface finish:
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Immersion gold
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The main specifications of this board is double
sided board, substrate is F4B, DK at 2.65, 210mm long by 115mm wide, 1.6mm
finished thick, finished copper 3oz, no solder mask no silkscreen, and surface
finish is immersion gold.
Let’s see the stack up.
Top layer and bottom layer are3oz copper
finished. F4b dielectric material is in the middle of 2 layers copper, showing
dielectric constant at 2.65
From the photo of this board, the track is
thicker than normal boards; surface finish is immersion gold and no solder mask
and silkscreen.
Our PCB Capability (PTFE):
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PCB Material:
|
PTFE
|
|
Code:
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F4B series
|
|
Dielectric
constant:
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2.2, 2.55 and
2.65
|
|
2.17, 2.45, 2.75
and 3.0
|
|
Layer count:
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1 Layer, 2
Layer, Multilayer, Hybrid type
|
|
Copper weight:
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0.5oz, 1oz, 2oz,
3oz
|
|
PCB thickness:
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0.17mm, 0.25mm,
0.5mm, 0.8mm, 1.0mm,
|
|
1.5mm, 2.0mm,
3.0mm, 4.0mm and 5.0mm, etc.
|
|
PCB Size:
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≤400mm X 500mm
|
|
Surface finish:
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Bare copper, HASL,
ENIG, Immersion tin etc.
|
The dielectric constant of F4B material is
wide, ranging 2.2 to 3.0 etc. Board thickness ranges 0.17mm to 5.0mm. We can
provide you with prototype service, small batches and mass production service.
Appendix: Data Sheet of PTFE(F4B):
|
Name
|
Test condition
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Unit
|
Value
|
|
Density
|
Normal state
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g/ cm3
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2.1～2.35
|
|
Moisture
Absorption
|
Dip in the distilled
water of 20±2℃ for 24
hours
|
%
|
≤0.02
|
|
Operating
Temperature
|
High-low temperature
chamber
|
℃
|
-50℃～+260℃
|
|
Thermal
Conductivity
|
|
W/m/k
|
0.8
|
|
CTE （typical）
|
0～100℃ （εr ：2.1~2.3）
|
ppm/℃
|
25（x）
|
|
34（y）
|
|
252（z）
|
|
CTE （typical）
|
0～100℃ （εr ：2.3~2.9）
|
ppm/℃
|
14（x）
|
|
21（y）
|
|
173（z）
|
|
CTE （typical）
|
0～100℃ （εr ：2.9~3.5）
|
ppm/℃
|
12（x）
|
|
15（y）
|
|
95（z）
|
|
Shrinkage
Factor
|
2 hours in boiling
water
|
%
|
0.0002
|
|
Surface Resistivity
|
500V DC
|
Normal state
|
M·Ω
|
≥1×104
|
|
Constant
humidity and temperature
|
≥1×103
|
|
Volume Resistivity
|
Normal state
|
MΩ.cm
|
≥1×106
|
|
Constant
humidity and temperature
|
≥1×105
|
|
Pin Resistance
|
500V DC
|
Normal state
|
MΩ
|
≥1×105
|
|
Constant humidity and temperature
|
≥1×103
|
|
Surface dielectric strength
|
Normal state
|
d=1mm（Kv/mm）
|
≥1.2
|
|
Constant
humidity and temperature
|
≥1.1
|
|
Dielectric Constant
|
10GHZ
|
εr
|
2.20，2.55，2.65，3.0，3.5 （±2%）
|
|
Dissipation Factor
|
10GHZ
|
tgδ
|
2.2
|
≤7×10-4
|
|
2.55~2.65
|
≤1×10-3
|
|
3.0~3.5
|
≤1.5×10-3
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORSHOP:
BICHENG TEAM PRACTICE:
BICHENG PCB CERTIFICATE:
