Rogers 4003 60mil
1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN
The selection of laminates
typically available to designers is significantly reduced once operational
frequencies increase to 500 MHz and above. RO4003C material possesses the properties needed by designers of RF
microwave circuits and matching networks and controlled impedance transmission
lines. Low dielectric loss allows RO4003C material to be used in many
applications where higher operating frequencies limit the use of conventional
circuit board materials.
The
temperature coefficient of dielectric constant is among the lowest of any circuit
board material, and the dielectric constant is stable over a broad frequency
range. RO4003C material's thermal
coefficient of expansion(CTE) provides several key benefits to the PCB
designers. The expansion coefficient of RO4003C is similar to that of copper
which allows the material to exhibit excellent dimensional stability, a
property needed for mixed dielectric multi-layer boards constructions. The low
Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in
severe thermal shock applications. RO4003C material has a Tg of >280C so its
expansion characteristics remain stable over the entire range of PCB processing
temperatures.
PCB
Specifications：
|
PCB SIZE
|
84 x 78mm=1PCS
|
|
BOARD TYPE
|
RF
PCB, Microwave PCB
|
|
Number
of Layers
|
Double sided PCB
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 35um(1oz)+PLATE
|
|
RO4003C 60mil
|
|
copper ------- 35um(1oz)+PLATE
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
10mil/12mil
|
|
Minimum
/ Maximum Holes:
|
0.3/2.3mm
|
|
Number
of Different Holes:
|
4
|
|
Number
of Drill Holes:
|
155
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control
|
NO
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO4003C 60mil, Tg 288℃
|
|
Final
foil external:
|
1.5oz
|
|
Final
foil internal:
|
0oz
|
|
Final
height of PCB:
|
1.6mm
±0.16
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Electroless
nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
|
|
Solder
Mask Apply To:
|
no Solder mask
reqruied
|
|
Solder
Mask Color:
|
no solder mask
required
|
|
Solder
Mask Type:
|
no solder mask
reqruied
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
no
silkscreen required
|
|
Colour
of Component Legend
|
no silkscreen
required
|
|
Manufacturer
Name or Logo:
|
no silkscreen
required
|
|
VIA
|
Plated
Through Hole(PTH)
|
|
FLAMIBILITY RATING
|
N/A
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
(0.15mm)
|
|
Board
plating:
|
0.0030"
(0.076mm)
|
|
Drill
tolerance:
|
0.002"
(0.05mm)
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Typical
applications are as follows:
Data
Sheet of Rogers 4003C (RO4003C)：
|
Property
|
RO4003C
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.38±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.55
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0027
0.0021
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+40
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.7 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
4.2 x 109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
19,650(2,850)
19,450(2,821)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
139(20.2)
100(14.5)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
276
(40)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.3
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
11
14
46
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃ TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
425
|
|
℃ TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.71
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.79
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
1.05
(6.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
N/A
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE：
