Rogers HF PCB Built on RT/Duroid 6002 30mil
0.762mm DK2.94 With Immersion Gold for Global Positioning System Antennas
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RT/duroid 6002 microwave material was
the first low loss and low dielectric constant laminate to offer superior
electrical and mechanical properties essential in designing complex microwave
structures which are mechanically reliable and electrically stable.
The thermal coefficient of dielectric constant
is extremely low from -55℃to
+150℃which provides the designers of
filters, oscillators and delay lines the electrical stability needed in today's
demanding applications.
A low Z axis coefficient of thermal
expansion(CTE) ensures excellent reliability of plated through holes. RT/duroid
6002 materials have been successfully temperature cycled (-55℃TO 125℃)
for over 5000 cycles without a single via failure.
Excellent dimensional stability (0.2 to 0.5
mils/inch) is achieved by matching the X and Y coefficient of expansion to
copper. This often eliminates double etching to achieve tight positional
tolerances.
The low tensile modulus (X,Y) greatly reduces
the stress applied to solder joints and allows the expansion of the laminate to
be constrained by a minimum amount of low CTE metal (6 ppm/℃) further increasing surface mount
reliability.
Applications particularly suited to the unique
properties of RT/duroid 6002 material include flat and non-planar structures
such antennas, complex mutli-layer circuits with inter-layer connections, and
microwave circuits for aerospace designs in hostile environments.
Typical applications:
1. Airborne radar systems
2. Beam forming networks
3. Commercial airline collision avoidance
4. Global positioning systems antennas
5. Ground base systems
6. High reliability complex multi-layer
circuits
7. Phased array antennas
8. Power backplanes
PCB Specifications:
|
PCB SIZE
|
60 x 35 mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 18um(0.5 oz)+plate TOP layer
|
|
RT/duroid 6002 0.762mm
|
|
copper ------- 18um(0.5 oz)+plate BOT layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5
mil / 5 mil
|
|
Minimum
/ Maximum Holes:
|
0.3mm
/ 1.0mm
|
|
Number
of Different Holes:
|
no
|
|
Number
of Drill Holes:
|
no
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RT/duroid
6002 0.762mm
|
|
Final
foil external:
|
1
oz
|
|
Final
foil internal:
|
1
oz
|
|
Final
height of PCB:
|
0.8
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
(61.4% ) 0.05µm over 3µm nickel
|
|
Solder
Mask Apply To:
|
Top and Bottom,
12micron Minimum
|
|
Solder
Mask Color:
|
Green,
PSR-2000GT600D, Taiyo Supplied.
|
|
Solder
Mask Type:
|
LPSM
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
Top
|
|
Colour
of Component Legend
|
White, IJR-4000
MW300, Taiyo brand
|
|
Manufacturer
Name or Logo:
|
Marked on the
board in a conductor and leged FREE AREA
|
|
VIA
|
N/A
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 6002 (RT/duroid 6002):
|
RT/duroid
6002 Typical Value
|
|
Property
|
RT/duroid 6002
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
2.94±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.94
|
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor,tanδ
|
0.0012
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of ε
|
+12
|
Z
|
ppm/℃
|
10 GHz 0℃-100℃
|
IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
106
|
Z
|
Mohm.cm
|
A
|
ASTM D 257
|
|
Surface Resistivity
|
107
|
Z
|
Mohm
|
A
|
ASTM D 257
|
|
Tensile Modulus
|
828(120)
|
X,Y
|
MPa(kpsi)
|
23℃
|
ASTM D 638
|
|
Ultimate Stress
|
6.9(1.0)
|
X,Y
|
MPa(kpsi)
|
|
Ultimate Strain
|
7.3
|
X,Y
|
%
|
|
Compressive Modulus
|
2482(360)
|
Z
|
MPa(kpsi)
|
|
ASTM D 638
|
|
Moisture Absorption
|
0.02
|
|
%
|
D48/50
|
IPC-TM-650
2.6.2.1
ASTM D 570
|
|
Thermal Conductivity
|
0.6
|
|
W/m/k
|
80℃
|
ASTM C518
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
16
16
24
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.1
|
|
gm/cm3
|
|
ASTM D 792
|
|
Specific Heat
|
0.93(0.22)
|
|
j/g/k
(BTU/ib/OF)
|
|
Calculated
|
|
Copper Peel
|
8.9(1.6)
|
|
Ibs/in.(N/mm)
|
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
