Rogers High
Frequency PCB Built on RT/Duroid 6010 DK 10.2 50mil With Immersion Gold for
Satellite Communications Systems
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Hi Guys,
Today we’re going to talk about Rogers 6010
PCB.
Rogers RT/duroid 6010LM microwave laminates are
ceramic-PTFE composites which are designed for electronic and microwave circuit
applications requiring a high dielectric constant. It's available with a
dielectric constant value of 10.2.
PCB Capability (RT/duroid 6010):
|
PCB Material:
|
Ceramic-PTFE
composite
|
|
Designator:
|
RT/duroid 6010LM
|
|
Dielectric
constant:
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10.2 ±0.25 (process)
|
|
10.7 (design)
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|
Layer count:
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1 Layer, 2 Layer
|
|
Copper weight:
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0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
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10mil (0.254mm),
25mil (0.635mm)
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50mil (1.27mm),
75mil (1.90mm)
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|
PCB size:
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≤400mm X 500mm
|
|
Solder mask:
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Green, Black,
Blue, Yellow, Red etc.
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|
Surface finish:
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Bare copper,
HASL, ENIG, Immersion tin, Immersion Silver, OSP.
|
RT/duroid 6010LM microwave laminates feature
ease of fabrication and stability in use. This property results in the possibility
of mass production and reducing the cost of goods. It has tight dielectric constant and
thickness control, low moisture absorption, and good thermal mechanical
stability.
Features and Benefits:
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1. High
dielectric constant for circuit size reduction
|
|
2. Low loss.
Ideal for operating at X-bank or below
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|
3. Low moisture
absorption reducing effects of moisture on electrical loss
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4. Low Z-axis
expansion providing reliable PTH in multilayer boards
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4. Tight DK and
thickness control for repeatable circuit performance
|
The typical applications are aircraft collision
avoidance systems, ground radar warning systems, patch antennas, satellite
communications systems etc.
Appendix: Properties of RT/duroid 6010LM
laminates. Thank you for your reading.
|
RT/duroid
6010 Typical Value
|
|
Property
|
RT/duroid 6010
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Direction
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Units
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Condition
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Test Method
|
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Dielectric
Constant,εProcess
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10.2±0.25
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Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped stripline
|
|
Dielectric Constant,εDesign
|
10.7
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Z
|
|
8GHz to 40 GHz
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Differential
Phase Length Method
|
|
Dissipation Factor,tanδ
|
0.0023
|
Z
|
|
10
GHz/A
|
IPC-TM-650
2.5.5.5
|
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Thermal Coefficient of ε
|
-425
|
Z
|
ppm/℃
|
-50℃-170℃
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IPC-TM-650
2.5.5.5
|
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Volume Resistivity
|
5 x 105
|
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Mohm.cm
|
A
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IPC
2.5.17.1
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Surface Resistivity
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5 x 106
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Mohm
|
A
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IPC
2.5.17.1
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Tensile Properties
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ASTM D638 (0.1/min. strain rate)
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Young's Modulus
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931(135) 559(81)
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X Y
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MPa(kpsi)
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A
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Ultimate Stress
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17(2.4) 13(1.9)
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X Y
|
MPa(kpsi)
|
A
|
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Ultimate Strain
|
9
to 15 7 to 14
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X Y
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%
|
A
|
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Compressive Properties
|
|
ASTM D695 (0.05/min. strain rate)
|
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Young's Modulus
|
2144
(311)
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Z
|
MPa(kpsi)
|
A
|
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Ultimate Stress
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47(6.9)
|
Z
|
MPa(kpsi)
|
A
|
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Ultimate Strain
|
25
|
Z
|
%
|
|
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Flexural Modulus
|
4364
(633) 3751 (544)
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X
|
MPa(kpsi)
|
A
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ASTM D790
|
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Ultimate Stress
|
36
(5.2) 32 (4.4)
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X Y
|
MPa(kpsi)
|
A
|
|
Deformation under load
|
0.26 1.3
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Z Z
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%
|
24hr/50℃/7MPa 24hr/150℃/7MPa
|
ASTM
D261
|
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Moisture Absorption
|
0.01
|
|
%
|
D48/50℃0.050"(1.27mm) thick
|
IPC-TM-650
2.6.2.1
|
|
Thermal Conductivity
|
0.86
|
|
W/m/k
|
80℃
|
ASTM
C518
|
Coefficient of Thermal Expansion
|
24
24
47
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650
2.4.41
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM
D3850
|
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Density
|
3.1
|
|
g/cm3
|
|
ASTM
D792
|
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Specific Heat
|
1.00(0.239)
|
|
j/g/k
(BTU/ib/OF)
|
|
Calculated
|
|
Copper Peel
|
12.3 (2.1)
|
|
pli (N/mm)
|
after solder float
|
IPC-TM-650
2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
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|
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MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
