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Direct Bond Copper DBC Ceramic Substrate for Semiconductor Modules

The Direct Bond Copper process is a widely acceptable and a time proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

DBC Ceramic Substrate Direct Bond Copper Sheet for IGBT

DBC ceramic substrate has high thermal conductivity, high current capacity and heat dissipation of the high-purity on ceramic. Product Details: Material: Alumina/ ZTA/ Si3N4 Function: Insulating ceramic. Type: Metalized Ceramicc. Can be customed: Yes, please provide drawings of specific products.

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