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Thermally Activated PUR Adhesives for High-Performance Substrate Bonding

Our thermally activated, moisture-curing PUR adhesives are high-performance thermoset systems designed for automated flat lamination. They offer a wide application temperature range (110°C - 140°C) and customizable open times to ensure superior bonding, exceptional aging resistance, and high production yields on diverse substrates including MDF, metals, plastics, and engineered panels for demanding furniture and architectural applications.

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