Arlon AD450 High Frequency PCB with 10mil,
20mil, 30mil, 40mil, 50mil, 60mil and 70mil Coating Immersion Gold for Antennas
Arlon's AD450 is a woven fiberglass reinforced,
ceramic filled, PTFE based composite material for microwave printed circuit
boards.
It provides better dielectric constant and thickness uniformity, better
dimensional stability as well as reduced manufacturing costs. The electrical properties
of AD450 suggest it can readily replace FR-4 in applications where high
frequencies and expectations for increased fidelity with broadband signal are
beyond the performance offered by FR-4.
With a dielectric constant of 4.5, most
FR-4 designs can be readily transferred. Its higher thermal conductivity and
lower CTE also promote its use in high power designs, where temperature
extremes and heat rejection are primary considerations.
Typical Applications:
Circuit board miniaturization
Higher frequency applications
Broadband antenna
Multimedia transmission systems
Our Capability (AD450):
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PCB
Material:
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Woven
Fiberglass Reinforced, Ceramic filled, PTFE based Composite
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Designation:
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AD450
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Dielectric constant:
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4.5
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Layer count:
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Double Layer, Multilayer, Hybrid PCB
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Copper
weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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PCB thickness:
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10mil (0.254mm), 20mil (0.508mm),
30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm),
70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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Surface
finish:
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Bare copper, HASL,
ENIG, OSP etc..
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Data Sheet of AD450:
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Property
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Test Method
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Condition
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Result
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Dielectric
Constant @ 200 MHz
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IPC TM-650 2.5.5.6
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C23/50
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4.5
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Loss Tangent
@ 10 GHz
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IPC TM-650 2.5.5.6
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C23/50
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0.0035
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Thermal
Coefficient of Er
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IPC TM-650 2.5.5.6
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- 10℃TO +140℃
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-233.5
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Copper Peel
Strength (lb/in)
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IPC TM-650 2.4.8
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A, TS
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>12
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Volume
Resistivity (MΩ-cm)
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IPC TM-650 2.5.17.1
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C96/35/90
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1.2 X 109
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Surface
Resistivity (MΩ)
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IPC TM-650 2.5.17.1
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C96/35/90
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4.5 X 107
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Arc
Resistance (seconds)
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ASTM D-495
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D48/50
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>180
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Tensile
Modulus (kpsi)
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ASTM D-638
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A, 23℃
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>700
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Tensile
Strength (kpsi)
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ASTM D-882
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A, 23℃
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>20
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Compressive
Modulus (kpsi)
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ASTM D-685
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A, 23℃
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>350
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Flexural
Modulus (kpsi)
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ASTM D-790
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A, 23℃
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>540
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Dielectric
Breakdown (kV)
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ASTM D-149
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D48/50
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>45
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Density (g/cm3)
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ASTM D-792 Method A
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A, 23℃
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2.45
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Water
Absorption (%)
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IPC TM-650 2.6.2.2
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E1/105 + D24/23
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0.07
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Coefficient of Thermal Expansion (ppm/℃)
X Axis
Y Axis
Z Axis
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IPC TM-650 2.4.24 TMA
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0℃to 100℃
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8
11
42
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Thermal
Conductivity (W /mK)
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ASTM E-1225
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100℃
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0.38
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Outgassing Total
Mass Loss (%)
Collected Volatile Condensable
Material (%) Water Vapor
Recovered
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NASA
SP-R-0022A Maximum 1.00% Maximum 0.10%
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125℃,≦10-6torr
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0.01 0.01 0.00
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Flammability
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UL 94 Vertical Burn
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C48/23/50, E24/125
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UL94-V0
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