Rogers
AD450 High Frequency PCB Built on 10mil 0.254mm Substrate With Immersion Gold
for Wide Band Antennas.
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers'
(Arlon) AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based
composite material for use as a printed circuit board substrate. The woven
fiberglass provides better dielectric constant and thickness uniformity, better
dimensional stability as well as reduced manufacturing costs.
With
a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in higher power
designs, where temperature extremes and heat rejection are primary
considerations.
AD450
is compatible with processing used for standard PTFE based printed circuit
board substrates. In addition, its low Z-axis thermal expansion will improve plated
through hole reliability, compared to typical PTFE based laminates.
Typical
Applications:
1.
Circuit Board Miniaturization
2.
Multimedia Transmission Systems
3.
Wide Band Antenna Applications
4.
Replacement of FR-4 in Higher Frequency Applications
Figure
1 demonstrates the stability of dielectric constant across frequency.
Figure
2 demonstrates the stability of dissipation factor across frequency.
Our
PCB Capability(AD450):
|
PCB
Material:
|
Woven
Fiberglass Reinforced, Ceramic filled, PTFE based Composite
|
|
Designation:
|
AD450
|
|
Dielectric constant:
|
4.5
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil (0.254mm), 20mil (0.508mm),
30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm),
70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Data
Sheet of AD450:
|
Typical
Properties: AD450
|
|
Property
|
Test Method
|
Condition
|
Result
|
|
Dielectric
Constant @ 200 MHz
|
IPC TM-650 2.5.5.6
|
C23/50
|
4.5
|
|
Loss Tangent
@ 10 GHz
|
IPC TM-650 2.5.5.6
|
C23/50
|
0.0035
|
|
Thermal
Coefficient of Er
|
IPC TM-650 2.5.5.6
|
- 10℃TO +140℃
|
-233.5
|
|
Copper Peel
Strength (lb/in)
|
IPC TM-650 2.4.8
|
A, TS
|
>12
|
|
Volume
Resistivity (MΩ-cm)
|
IPC TM-650 2.5.17.1
|
C96/35/90
|
1.2 X 109
|
|
Surface
Resistivity (MΩ)
|
IPC TM-650 2.5.17.1
|
C96/35/90
|
4.5 X 107
|
|
Arc
Resistance (seconds)
|
ASTM D-495
|
D48/50
|
>180
|
|
Tensile
Modulus (kpsi)
|
ASTM D-638
|
A, 23℃
|
>700
|
|
Tensile
Strength (kpsi)
|
ASTM D-882
|
A, 23℃
|
>20
|
|
Compressive
Modulus (kpsi)
|
ASTM D-685
|
A, 23℃
|
>350
|
|
Flexural
Modulus (kpsi)
|
ASTM D-790
|
A, 23℃
|
>540
|
|
Dielectric
Breakdown (kV)
|
ASTM D-149
|
D48/50
|
>45
|
|
Density (g/cm3)
|
ASTM D-792 Method A
|
A, 23℃
|
2.45
|
|
Water
Absorption (%)
|
IPC TM-650 2.6.2.2
|
E1/105 + D24/23
|
0.07
|
|
Coefficient of Thermal Expansion (ppm/℃)
X Axis
Y Axis
Z Axis
|
IPC TM-650 2.4.24 TMA
|
0℃to 100℃
|
8
11
42
|
|
Thermal
Conductivity (W /mK)
|
ASTM E-1225
|
100℃
|
0.38
|
|
Outgassing Total
Mass Loss (%)
Collected Volatile Condensable
Material (%) Water Vapor
Recovered
|
NASA
SP-R-0022A Maximum 1.00% Maximum 0.10%
|
125℃,≦10-6torr
|
0.01 0.01 0.00
|
|
Flammability
|
UL 94 Vertical Burn
|
C48/23/50, E24/125
|
UL94-V0
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
