High
Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃With Immersion Gold
1.1
General description
It's 2.0 mm thick with white silkscreen
on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high
density interconnection layers, microvias on different layers are stacked. The
base material is from ITEQ supplying in 1 up board per panel.They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for
shipment.
1.2
Our Advantages
ISO9001,
ISO14001, IATF16949, UL Certified;
Prototype
to volume Production Capability;
16000㎡workshop;
30000㎡output capability per month;
8000
types of PCB's per month;
IPC
Class 2 / IPC Class 3;
Eligible
products rate of first production: >95%
1.3
Applications of HDI PCBs
Automotive,
GPS Trackers
5G
WiFi, Embedded Systems Basics
Smartphones
and tablets
Wearable
technology and Healthcare
Access
Control Solutions and Aerospace
1.4
Parameter and data sheet
|
Number
of Layers
|
14-Layer
|
|
Board Type
|
Multilayer
PCB
|
|
Board size
|
220mm
x 170mm=4PCS
|
|
Board Thickness
|
2.0
mm +/-0.16
|
|
Board Material
|
FR-4
|
|
Board Material Supplier
|
ITEQ
|
|
Tg Value of Board Material
|
170℃
|
|
|
|
PTH Cu thickness
|
≥20 um
|
|
Inner Iayer Cu thicknes
|
18
um (0.5oz)
|
|
Surface Cu thickness
|
35
um (1oz)
|
|
|
|
Solder Mask Type and Model No.
|
LPSM,
PSR-2000GT600D
|
|
Solder Mask Supplier
|
TAIYO
|
|
Solder Mask Colour
|
Green
|
|
Number of Solder Masks
|
2
|
|
Thickness of Solder Mask
|
14
um
|
|
|
|
Type of Silkscreen Ink
|
IJR-4000
MW300
|
|
Supplier of Silkscreen
|
TAIYO
|
|
Color of Silkscreen
|
White
|
|
Number of Silkscreen
|
1
|
|
|
|
Mininum Trace (mil)
|
5.8
mil
|
|
Minimum Gap(mil)
|
6.2
mil
|
|
|
|
Surface Finish
|
Immersion
Gold
|
|
RoHS Required
|
Yes
|
|
Warpage
|
0.25%
|
|
Thermal Shock Test
|
Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
|
|
Solderablity Test
|
Pass, 255±5℃,5 seconds Wetting Area Least 95%
|
|
Function
|
100%
Pass electrical test
|
|
Workmanship
|
Compliance
with IPC-A-600H & IPC-6012C Class 2
|
|
Drill Table (mm)
|
|
|
T1
|
0.300
|
|
T2
|
0.450
|
|
T3
|
0.580
|
|
T4
|
0.590
|
|
T5
|
0.690
|
|
T6
|
0.650
|
|
T7
|
1.000
|
|
T8
|
1.150
|
|
T9
|
1.200
|
|
T10
|
1.300
|
|
T11
|
1.400
|
|
T12
|
1.500
|
|
T13
|
1.600
|
|
T14
|
1.700
|
|
T15
|
2.050
|
|
T16
|
2.550
|
|
T17
|
3.000
|
|
T18
|
3.200
|
|
T19
|
3.450
|
1.5
Different Types of HDI PCBs
To
simplify the high density interconnect PCB, we define 3 types of HDI PCBs as
below:
1+N+1,
PCBs contain 1-time laser drill and pressing in the HDI boards.
I+N+I
(I≥2), PCBs contain 2-time laser
drill and pressing or more times laser drill and pressing, including the
microvias staggered or stacked on different layers.
Any
layer HDI, blind vias and buried vias can be freely put on different layers as
designer want.
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