Multilayer
Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold
(Printed
circuits boards are custom-made products, the picture and parameters shown are
just for reference)
1.1
General description
It's 1.6 mm thick with white
silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The
base material is from Taiwan ITEQ supplying 1 up PCB per panel. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are
packed for shipment.
1.2
Features and benefits
1.
High Tg Materials are RoHS compliant and suitable for high thermal reliability
needs;
2.
Immersin gold has high solderability, no stressing of circuit boards and less
contamination of PCB surface;
3. Delivery
on time. Higher than 98% on-time-delivery rate;
4.
30000㎡output capability per month;
5. More
than 18 years of experience;
6. Powerful
PCB capabilities support your research and development, sales and marketing;
7.
Any Layer HDI PCBs;
8.
International approvals;
1.3
PCB Specifications
|
PCB SIZE
|
215 x
212mm=1PCS
|
|
BOARD TYPE
|
Multilayer
PCB
|
|
Number
of Layers
|
8 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 18um(0.5oz)+plate TOP layer
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 35um(1oz) MidLayer 1
|
|
FR-4 0.2mm
|
|
copper ------- 35um(1oz) MidLayer 2
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 35um(1oz) MidLayer 3
|
|
FR-4 0.2mm
|
|
copper ------- 35um(1oz) MidLayer 4
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 35um(1oz) MidLayer 5
|
|
FR-4 0.2mm
|
|
copper ------- 35um(1oz) MidLayer 6
|
|
Prepreg 7628(43%) 0.195mm
|
|
copper ------- 18um(0.5oz)+plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
4mil/4mil
|
|
Minimum
/ Maximum Holes:
|
0.3/3.2mm
|
|
Number
of Different Holes:
|
18
|
|
Number
of Drill Holes:
|
11584
|
|
Number
of Milled Slots:
|
2
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
FR-4 TG170℃,
er<5.4.IT-180, ITEQ Supplied
|
|
Final
foil external:
|
1oz
|
|
Final
foil internal:
|
1oz
|
|
Final
height of PCB:
|
1.6mm
±0.16
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
(32.1% ) 0.05µm over 3µm nickel
|
|
Solder
Mask Apply To:
|
TOP and Bottom,
12micron Minimum
|
|
Solder
Mask Color:
|
Green,
PSR-2000 KX700G, Taiyo Supplied.
|
|
Solder
Mask Type:
|
LPSM
|
|
CONTOUR/CUTTING
|
Routing,
stamp holes.
|
|
MARKING
|
|
|
Side of
Component Legend
|
TOP
and Bottom.
|
|
Colour
of Component Legend
|
White, S-380W,
Taiyo Supplied.
|
|
Manufacturer
Name or Logo:
|
Marked on the
board in a conductor and leged FREE AREA
|
|
VIA
|
plated
through hole(PTH), minimum size 0.3mm.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
1.4
Applications
WiFi
Range Extender
CCTV
System
Satellite
Communication
5G
Speed
Router
WiFi 4G
Solar
Panel Inverter
GPS
Tracking Systems
Embedded
Processor
PLC
Programs
Phone
systems
1.5
Glass Transition Temperature (Tg)
The
thermal properties of the resin system are characterized by the glass
transition temperature (Tg), which always is expressed in °C. The most commonly
used property is the thermal expansion. When measuring the expansion versus the
temperature, we can get a curve as shown in following picture. The Tg is
determined by the intersection of the tangents of the flat and steep parts of
the expansion curve. Below the glass transition temperature, the epoxy resin is
rigid and glassy. When the glass transition temperature is exceeded, it changes
to a soft and rubbery state.
For
the most commonly used types of epoxy resin (FR-4 grade), the glass transition
temperature is in the range 115-130°C, so when the board is soldered, the glass
transition temperature is easily exceeded. The board expands in the Z-axis
direction and stresses the copper of the hole wall. The expansion of epoxy
resin is about 15 to 20 times greater than that of copper when exceeding Tg.
This implies a certain risk of wall cracking in plated-through holes, and the
more resin around the hole wall, the greater risk. Below the glass transition
temperature, the expansion ratio between epoxy and copper is only three times,
so here the risk of cracking is negligible.
The
Tg of general board is above 130 celsius degrees, high Tg is generally greater
than 170 celsius degrees, medium Tg is about greater than 150 celsius
degrees.PCB boards with Tg ≥ 170 ° C are usually called high Tg PCBs.
1.6
Manufacturing Process of Multi-layer PTH PCB (via filled)
(1).
Material Shearing
(2).
Inner Layer Dry Film
(3).
Inner Layer Etching
(4).
AOI 1
(5).
Black Oxidation
(6).
Milling Outline Frame
(7).
Inner Layer Drilling
(8).
PTH 1
(9).
Inner Layer Dry Film
(10).
Pattern Plating 1
(11).
Via filled
(12).
Outer Layer Drilling
(13).
PTH 2
(14).
Pattern Plating 2
(15).
Outer Layer Dry Film
(16).
Copper-tin Electro-Plating
(17).
Peeling and Etching
(18).
AOI 2
(19).
Solder Mask
(20).
Silkscreen Printing
(21).
Surface Finishing
(22).
Electrical Testing
(23).
Prolie Contouring
(24).
FQC
(25).
Packaging
(26).
Delivery
The different materials used to make multilayer PCBs are boards, copper
foils, resin systems, substrates, through holes, infused fiberglass
boards. These materials can be laminated together using an alternating
method. By choosing a professional Multilayer PCB Board supplier, you
can save a lot of trouble and save money.
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