Rogers RO3006 Microwave PCB 2-Layer Rogers 3006
25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RO3006 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and
RF applications. The
mechanical properties are consistent. This allows the designer to develop
multi-layer board designs without encountering warpages or reliability
problems. RO3006 materials exhibit a coefficient of thermal expansion(CTE) in
the X and Y axis of 17 ppm/℃.
This expansion coefficient is matched to that of copper, which allows the
material to exhibit excellent dimensional stability, with typical etch
shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE
is 24 ppm/℃, which
provides exceptional plated through-hole reliability, even in severe
environments.
Typical applications:
PCB Specifications:
|
PCB SIZE
|
70 x 75mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 18um(0.5 oz)+plate TOP layer
|
|
RO3006 0.635mm
|
|
copper ------- 18um(0.5 oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
4
mil / 4 mil
|
|
Minimum
/ Maximum Holes:
|
0.4mm
/ 1.0mm
|
|
Number
of Different Holes:
|
n/a
|
|
Number
of Drill Holes:
|
n/a
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO3006
0.635mm
|
|
Final
foil external:
|
1
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.8
mm ±0.1mm
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion Gold
|
|
Solder
Mask Apply To:
|
Bottom, 12micron
Minimum
|
|
Solder
Mask Color:
|
Green,
PSR-2000GT600D, Taiyo Supplied.
|
|
Solder
Mask Type:
|
LPSM
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
Bottom
|
|
Colour
of Component Legend
|
White, IJR-4000
MW300, Taiyo brand
|
|
Manufacturer
Name or Logo:
|
Marked on the
board in a conductor and leged FREE AREA
|
|
VIA
|
N/A
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 3006 (RO3006):
|
RO3006 Typical Value
|
|
Property
|
RO3006
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.15±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
6.5
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.002
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-262
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.27
0.15
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
105
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
105
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
1498
1293
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.02
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
0.86
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.79
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
17
24
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.6
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper Peel
Stength
|
7.1
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
