Rogers
RO4360 High Frequency PCB Based on 6-layer with 8mil Core Coating Immersion
Gold for Small Cell Transceivers
RO4360G2
laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced,
hydrocarbon ceramic-filled thermoset materials that provide the ideal balance
of performance and processing ease.
RO4360G2
laminates process similar to FR-4 and are automated assembly compatible. They
have a low Z-axis CTE for design flexibility and have the same high Tg as all
of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.
RO4360G2
laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit
dimensions in applications where size and cost are critical. They are the best
value choice for engineers working on designs including power amplifiers, patch
antennas, ground-based radar, and other general RF applications.
Features
and benefits:
1.
Thermoset resin system specially formulated to meet 6.15 Dk
1).
Ease of fabrication / processes similar to FR-4
2).
Material repeatability
3).
Low loss
4).
High thermal conductivity
5).
Lower total PCB cost solution than competing PTFE products,
2.
Low Z-axis CTE / High Tg
1).
Design flexibility
2).
Plated through-hole reliability
3).
Automated assembly compatible
3.
Environmentally friendly
1.)
Lead free process compatible
4.
Regional finished goods inventory
1).
Short lead times / quick inventory turns
2).
Efficient supply chain
Some
Typical Applications:
1.
Base Station Power Amplifiers
2.
Small Cell Transceivers
3.
Patch antennas
4.
Ground-based Radar
PCB
Capability:
|
PCB Capability (RO4360G2)
|
|
PCB Material:
|
Hydrocarbon Ceramic-filled Thermoset
Materials
|
|
Designation:
|
RO4360G2
|
|
Dielectric constant:
|
6.15 ±0.15
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
8mil (0.203mm), 12mil (0.705mm), 16mil
(0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Stack
up:
In order to make the progress of electronic communication technology
faster. High-quality high-speed transmission, many of today's
communication facilities use high-frequency printed multilayer pcb
circuit boards. Because the material of high frequency multilayer pcb
has good electrical function and good chemical stability.
Data
Sheet of RO4360G2:
|
RO4360G2
Typical Value
|
|
Property
|
RO4360G2
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.15±0.15
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
2.5 GHz/23℃
|
|
Dissipation Factor,tanδ
|
0.0038
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Conductivity
|
0.75
|
|
W/mK
|
50℃
|
ASTM D-5470
|
|
Volume Resistivity
|
4.0 X 1013
|
|
Ω.cm
|
Elevated T
|
IPC-TM-650 2.5.17.1
|
|
Surface Resistivity
|
9.0 X 1012
|
|
Ω
|
Elevated T
|
IPC-TM-650 2.5.17.1
|
|
Electrical Strength
|
784
|
Z
|
V/mil
|
|
IPC-TM-650 2.5.6.2
|
|
Tensile Strength
|
131
(19) 97(14)
|
X Y
|
MPa (kpsi)
|
40 hrs 50%RH/23
|
ASTM D638
|
|
Flexural Strength
|
213(31) 145(21)
|
X Y
|
Mpa (kpsi)
|
40 hrs 50%RH/23
|
IPC-TM-650, 2.4.4
|
Coefficient of Thermal Expansion
|
13 14 28
|
X Y Z
|
ppm/℃
|
-50℃to 288℃
After Replicated Heat Cycle
|
IPC-TM-650, 2.1.41
|
|
Tg
|
>280
|
|
℃ TMA
|
|
IPC-TM-650 2.4.24.3
|
|
Td
|
407
|
|
℃
|
|
ASTM D3850 using TGA
|
|
T288
|
>30
|
Z
|
min
|
30
min / 125℃Prebake
|
IPC-TM-650 2.2.24.1
|
|
Moisure Absorption
|
0.08
|
|
%
|
50℃/48hr
|
IPC-TM-650 2.6.2.1
ASTM D570
|
|
Thermal Coefficient of er
|
-131 @10 GHz
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650, 2.5.5.5
|
|
Density
|
2.16
|
|
gm/cm3
|
RT
|
ASTM D792
|
|
Copper Peel Stength
|
5.2 (0.91)
|
|
pli (N/mm)
|
Condtion B
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94 File QMTS2.
E102765
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
