Rogers
RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for
Base Station Power Amplifiers
RO4360G2 laminates extend Rogers' portfolio
of high performance materials by providing customers with a product that is
lead-free process capable and offers better rigidity for improved
processability in multi-layer board constructions, while reducing material and
fabrication costs.
RO4360G2
laminates process similar to FR-4 and are automated assembly compatible. They
have a low Z-axis CTE for design flexibility and have the same high Tg as all
of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F
prepreg and lower-Dk RO4000 laminate in multi-layer designs.
RO4360G2
laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit
dimensions in applications where size and cost are critical. They are the best
value choice for engineers working on designs including power amplifiers, patch
antennas, ground-based radar, and other general RF applications.
Features
and benefits:
1.
Thermoset resin system specially formulated to meet 6.15 Dk
1).
Ease of fabrication / processes similar to FR-4
2).
Material repeatability
3).
Low loss
4). High
thermal conductivity
5).
Lower total PCB cost solution than competing PTFE products,
2.
Low Z-axis CTE / High Tg
1).
Design flexibility
2).
Plated through-hole reliability
3).
Automated assembly compatible
3.
Environmentally friendly
1.)
Lead free process compatible
4.
Regional finished goods inventory
1).
Short lead times / quick inventory turns
2).
Efficient supply chain
Some
Typical Applications:
PCB Capability:
|
PCB Capability (RO4360G2)
|
|
PCB Material:
|
Hydrocarbon Ceramic-filled Thermoset
Materials
|
|
Designation:
|
RO4360G2
|
|
Dielectric constant:
|
6.15 ±0.15
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
8mil (0.203mm), 12mil (0.705mm), 16mil
(0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
|
Data
Sheet of RO4360G2:
|
RO4360G2
Typical Value
|
|
Property
|
RO4360G2
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.15±0.15
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
2.5 GHz/23℃
|
|
Dissipation Factor,tanδ
|
0.0038
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Conductivity
|
0.75
|
|
W/mK
|
50℃
|
ASTM D-5470
|
|
Volume Resistivity
|
4.0 X 1013
|
|
Ω.cm
|
Elevated T
|
IPC-TM-650 2.5.17.1
|
|
Surface Resistivity
|
9.0 X 1012
|
|
Ω
|
Elevated T
|
IPC-TM-650 2.5.17.1
|
|
Electrical Strength
|
784
|
Z
|
V/mil
|
|
IPC-TM-650 2.5.6.2
|
|
Tensile Strength
|
131
(19) 97(14)
|
X Y
|
MPa (kpsi)
|
40 hrs 50%RH/23
|
ASTM D638
|
|
Flexural Strength
|
213(31) 145(21)
|
X Y
|
Mpa (kpsi)
|
40 hrs 50%RH/23
|
IPC-TM-650, 2.4.4
|
Coefficient of Thermal Expansion
|
13 14 28
|
X Y Z
|
ppm/℃
|
-50℃to 288℃
After Replicated Heat Cycle
|
IPC-TM-650, 2.1.41
|
|
Tg
|
>280
|
|
℃ TMA
|
|
IPC-TM-650 2.4.24.3
|
|
Td
|
407
|
|
℃
|
|
ASTM D3850 using TGA
|
|
T288
|
>30
|
Z
|
min
|
30
min / 125℃Prebake
|
IPC-TM-650 2.2.24.1
|
|
Moisure Absorption
|
0.08
|
|
%
|
50℃/48hr
|
IPC-TM-650 2.6.2.1
ASTM D570
|
|
Thermal Coefficient of er
|
-131 @10 GHz
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650, 2.5.5.5
|
|
Density
|
2.16
|
|
gm/cm3
|
RT
|
ASTM D792
|
|
Copper Peel Stength
|
5.2 (0.91)
|
|
pli (N/mm)
|
Condtion B
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94 File QMTS2.
E102765
|
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