Rogers
RO4730G3 High Frequency PCB 2-Layer Rogers 4730 20mil 0.508mm Printed Circuit
Board DK3.0 DF 0.0028 Microwave PCB
The RO4730G3 materials have a dielectric constant of 3.0 and a loss tangent of 0.0022
measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values
allow antenna designers to realize substantial gain values while minimizing signal
loss. Materials are available with demonstrated low PIM performance, with
values better than -160dBc.
RO4730G3 materials are compatible with
conventional epoxy and high temperature lead-free solder processing. It does
not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F
bondply at 175℃.
The resin systems of RO4730G3 are designed to provide the properties sought
after by antenna designers. The glass transition temperature exceeds 280oC,
leading to a low Z-axis CTE, excellent plated through holes reliability, and
lead free solder processability.
Typical application is cellular base station
antennas.
General
description
This is a type of double sided RF PCB built on
0.508mm (20mil) RO4730G3 for the application of Cellular Base Station Antenna
PCB.
Basic
specifications:
Base material: RO4730G3 20mil (0.508mm)
Dielectric constant: 3.0+/-0.5
Layer count: 2 layers
Type: Through holes
Format: 110mm x 50mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 0.60 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months
Data Sheet of Rogers 4730 (RO4730G3):
|
RO4730G3 Typical Value
|
|
Property
|
RO4730G3
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.0±0.5
|
Z
|
|
10 GHz 23℃
|
IPC-TM-650 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.98
|
Z
|
|
1.7 GHz to 5 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor,tanδ
|
0.0028
|
Z
|
|
10 GHz 23℃
|
IPC-TM-650 2.5.5.5
|
|
|
2.5
GHz
|
|
Thermal Coefficient of ε
|
+34
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional Stability
|
<0.4
|
X,
Y
|
mm/m
|
after
etech +E2/150℃
|
IPC-TM-650 2.4.39A
|
|
Volume Resistivity (0.030")
|
9
X 107
|
|
MΩ.cm
|
COND A
|
IPC-TM-650 2.5.17.1
|
|
Surface Resistivity (0.030")
|
7.2
X 105
|
|
MΩ
|
COND A
|
IPC-TM-650 2.5.17.1
|
|
PIM
|
-165
|
|
dBc
|
50 ohm 0.060"
|
43 dBm 1900 MHz
|
|
Electrical Strength (0.030")
|
730
|
Z
|
V/mil
|
|
IPC-TM-650 2.5.6.2
|
|
Flexural Strength MD
|
181 (26.3)
|
|
Mpa (kpsi)
|
RT
|
ASTM D790
|
|
CMD
|
139 (20.2)
|
|
|
Moisure Absorption
|
0.093
|
-
|
%
|
48/50
|
IPC-TM-650 2.6.2.1
ASTM D570
|
|
Thermal Conductivity
|
0.45
|
Z
|
W/mK
|
50℃
|
ASTM D5470
|
Coefficient of Thermal Expansion
|
15.9
14.4
35.2
|
X
Y
Z
|
ppm/℃
|
-50℃to 288℃
|
IPC-TM-650 2.4.4.1
|
|
Tg
|
>280
|
|
℃
|
|
IPC-TM-650 2.4.24
|
|
Td
|
411
|
|
℃
|
|
ASTM D3850
|
|
Density
|
1.58
|
|
gm/cm3
|
|
ASTM D792
|
|
Copper Peel Stength
|
4.1
|
|
pli
|
1oz,LoPro EDC
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
BICHENG PCB TEAM PRACTICE:
BICHNEG PCB MANUFACTURING PROCESS:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:
