Rogers
TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3,
TMM6, TMM10, TMM10i, TMM13i
It's available with dielectric constant at 4.70. The
electrical and mechanical properties of TMM4 combine many of the benefits of
both ceramic and traditional PTFE microwave circuit materials, without
requiring the specialized production techniques. It does not require a sodium
napthanate treatment prior to electroless plating.
TMM4 has an exceptionally low thermal coefficient of dielectric constant, typically
less than 30 PPM/°C. The material’s isotropic coefficient of thermal expansion,
very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal
conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic
materials, facilitating heat removal.
TMM4 is based on thermoset resins, and do not soften when heated. As a result, wire
bonding of component leads to circuit traces can be performed without concerns
of pad lifting or substrate deformation.
Our
PCB Capability (TMM4):
|
PCB
Material:
|
Composite of
Ceramic, hydrocarbon and thermoset polymer
|
|
Designator:
|
TMM4
|
|
Dielectric constant:
|
4.5 ±0.045 (process);
4.7 (design)
|
|
Layer count:
|
1 Layer, 2 Layer
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz
(35µm), 2oz (70µm)
|
|
PCB thickness:
|
15mil
(0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil
(1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil
(3.175mm) etc.
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, Immersion tin, OSP.
|
Main
Applications are as follows:
-
Chip
testers
-
Dielectric
polarizers and lenses
-
Filters
and coupler
-
Global
Positioning Systems Antennas
-
Patch
Antennas
-
Power
amplifiers and combiners
-
RF
and microwave circuitry
-
Satellite
communication systems
Data
Sheet of TMM4:
|
Property
|
|
TMM4
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
4.5±0.045
|
Z
|
|
10 GHz
|
IPC-TM-650
2.5.5.5
|
|
Dielectric Constant,εDesign
|
4.7
|
-
|
-
|
8GHz to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factor (process)
|
0.002
|
Z
|
-
|
10
GHz
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of dielectric constant
|
+15
|
-
|
ppm/°K
|
-55℃-125℃
|
IPC-TM-650
2.5.5.5
|
|
Insulation Resistance
|
>2000
|
-
|
Gohm
|
C/96/60/95
|
ASTM
D257
|
|
Volume Resistivity
|
6 x 108
|
-
|
Mohm.cm
|
-
|
ASTM
D257
|
|
Surface Resistivity
|
1 x 109
|
-
|
Mohm
|
-
|
ASTM
D257
|
|
Electrical
Strength(dielectric strength)
|
371
|
Z
|
V/mil
|
-
|
IPC-TM-650
method 2.5.6.2
|
|
Thermal Properties
|
|
Decompositioin Temperature(Td)
|
425
|
425
|
℃TGA
|
-
|
ASTM D3850
|
|
Coefficient of Thermal Expansion - x
|
16
|
X
|
ppm/K
|
0 to 140℃
|
ASTM E 831
IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Y
|
16
|
Y
|
ppm/K
|
0 to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Coefficient of Thermal Expansion - Z
|
21
|
Z
|
ppm/K
|
0 to 140℃
|
ASTM
E 831 IPC-TM-650, 2.4.41
|
|
Thermal Conductivity
|
0.7
|
Z
|
W/m/K
|
80℃
|
ASTM
C518
|
|
Mechanical Properties
|
|
Copper Peel Strength after Thermal Stress
|
5.7 (1.0)
|
X,Y
|
lb/inch (N/mm)
|
after solder float 1 oz. EDC
|
IPC-TM-650
Method 2.4.8
|
|
Flexural Strength (MD/CMD)
|
15.91
|
X,Y
|
kpsi
|
A
|
ASTM
D790
|
|
Flexural Modulus (MD/CMD)
|
1.76
|
X,Y
|
Mpsi
|
A
|
ASTM
D790
|
|
Physical Properties
|
|
Moisture Absorption (2X2)
|
1.27mm
(0.050")
|
0.07
|
-
|
%
|
D/24/23
|
ASTM D570
|
|
3.18mm (0.125")
|
0.18
|
|
Specific Gravity
|
2.07
|
-
|
-
|
A
|
ASTM
D792
|
|
Specific Heat Capacity
|
0.83
|
-
|
J/g/K
|
A
|
Calculated
|
|
Lead-Free Process Compatible
|
YES
|
-
|
-
|
-
|
-
|
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