Dissipating Materials Nano AlN Powders Used in Electronics

Spec: 100-200nm, 300-500nm, 1-2um, 99.5%, amouphous

Application for nano AlN powder:

Electronic materials: thermal conductivity of aluminum nitride is about 10 times the aluminum oxide, can be effectively dissipate heat, manufacturing integrated circuits substrate, electronic devices, optical devices, radiators, temperature crucible prepared metal polymer matrix composites, especially in high temperature sealing adhesives and electronic seals loading materials to improve the cooling performance and strength characteristics there is an excellent prospect.

Such as the application in thermal silica and conductive epoxy: Use nano aluminum nitride to prepared ultrahigh thermal silica, which has good thermal conductivity, good insulation properties over point, wide electrical insulation and temperature (temperature 80-250 ° C), low consistency and good construction performance, it is widely used in the heat transfer medium of electronic devices, improve work efficiency. Real practical application in many fields, such as nano-thermal paste application as CPU and heat sink, power transistors, thyristors, diodes, contact with the substrate slit at a heat transfer medium, increase the contact area between them, to achieve better cooling effect.