Sub-micron SIC powder as a thermal conductive filler for inside IT devices.

Sub-micron SIC powders are characterized by its high thermal conductivity, high-temperature strength, low thermal expansion, resistance to chemical reaction and ability to function as a semiconductor.



Silicon carbide sic also known as carborundum is a unique compound of carbon and silicon is one of the hardest materials. Silicon carbide is a very stable and chemically inert compound. It is an extremely hard material, with a Mohs hardness rating of 9, close to that of diamond. It is also characterized by its high thermal conductivity, high-temperature strength, low thermal expansion, resistance to chemical reaction and ability to function as a semiconductor.

HWNANOMATERIAL is supplying various kind of sized beta sic powders(nano, sub-micron and micron).

40-50nm,100-300nm, 500nm, 1um 5um, 7um, 10um, etc, purity 99%


Sic powder applications:
Thermal conductive filler
Automobile brakes 
Ceramic plates in bulletproof vests
Light emitting diodes and sensors
Semiconductor process equipment
Hot gas flow liners
Fixed and moving turbine components

Seals, bearing, pump vanes


In addtion to Beta SIC powder as good thermal conductive filler , Common thermal conductive fillers also include AL2O3 powder, ALN powder, BN powder, MgO powder. Different fillers have their own characteristics. When choosing fillers, we should make full use of their advantages of each and adopt several kinds of fillers for mixed use to play a synergistic effect, which can not only achieve a higher thermal conductivity, but also effectively reduce the cost and ensure the miscibility of fillers and organosilicone matrix.



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