Taconic
CER-10 RF Printed Circuit Board 2-Layer CER-10 62mil 1.58mm PCB with Immersion
Gold
Its proprietary composition
results in low moisture absorption and uniform electrical properties.
Benefits:
Exceptional
Interlaminar Bond
Low
moisture absorption
Enhanced
dimensonal stability
Low
Z-Axis expansion
Stable
DK over frequency
Increased
flexural strength
Circuit
board miniturization
Applications:
Power
amplifiers
Filters
and couplers
Passive
components
CER-10’s
woven glass reinforcement ensures excellent dimensional stability and enhances
flexural strength. This DK-10 laminate exhibits low Z-axis expansion (CTE 46
ppm/°C), allowing for plated-through-hole reliability in extreme thermal
environments.
CER-10
laminates exhibit flammability of V-0 and are tested in accordance with IPC-TM
650. A certificate of conformance containing lot-specific data accompanies each
shipment.
Our
PCB Capability (CER-10):
|
PCB
Material:
|
Organic-ceramic
Laminate based on Woven Glass Reinforcement.
|
|
Designation:
|
CER-10
|
|
Dielectric constant:
|
10
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
25mil
(0.635mm), 30mil(0.762mm), 47mil(1.194mm), 50mil (1.27mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG,Silver, Tin and OSP etc..
|
Typical
Value of CER-10:
|
Property
|
Test Method
|
Unit
|
Value
|
Unit
|
Value
|
|
Dielectric
Constant (Nominal)
|
IPC-TM-650 2.5.5.6
|
|
10
|
|
10
|
|
Dissipation
Factor 10 GHz
|
IPC-TM-650 2.5.5.5.1
|
|
0.0035
|
|
0.0035
|
|
Moisture
Absorption
|
IPC-TM-650 2.6.2.1
|
%
|
0.02
|
%
|
0.02
|
|
Dielectric
Breakdown
|
IPC-TM-650 2.5.6
|
kV
|
44
|
kV
|
44
|
|
Volume
Resistivity
|
IPC-TM-650 2.5.17.1
|
Mohm/cm
|
2.1
x 108
|
Mohm/cm
|
2.1
x 108
|
|
Surface
Resistivity
|
IPC-TM-650 2.5.17.1
|
Mohm
|
1.1
x 109
|
Mohm
|
1.1
x 109
|
|
Arc
Resistance
|
IPC-TM-650 2.5.1
|
Seconds
|
>180
|
Seconds
|
>180
|
|
Flexural
Strength (MD)
|
ASTM D 790
|
psi
|
16500
|
N/mm2
|
114
|
|
Flexural
Strength (CD)
|
ASTM D 790
|
psi
|
15500
|
N/mm2
|
107
|
|
Tensile
Strength (MD)
|
ASTM D 638
|
psi
|
7700
|
N/mm2
|
53
|
|
Tensile
Strength (CD)
|
ASTM D 3039
|
psi
|
6700
|
N/mm2
|
46
|
|
Peel Strength
(1 oz. ED)
|
IPC-TM-650 2.4.8
|
lbs/linear inch
|
9
|
N/mm
|
1.61
|
|
Dimensional
Stability (MD)
|
IPC-TM-650 2.4.39
|
in/in
|
-0.0002
|
mm/mm
|
-0.0002
|
|
Dimensional
Stability (CD)
|
IPC-TM-650 2.4.39
|
in/in
|
-0.0003
|
mm/mm
|
-0.0003
|
|
Density
(Specific Gravity)
|
|
g/cm3
|
3.05
|
g/cm3
|
3.05
|
|
Thermal
Conductivity
|
ASTM F 433
|
W/m/K
|
0.63
|
W/m/K
|
0.63
|
|
CTE (x-y)
|
ASTM D 3386 (TMA)
|
ppm/℃
|
13-15
|
ppm/℃
|
13-15
|
|
CTE (z)
|
ASTM D 3386 (TMA)
|
ppm/℃
|
46
|
ppm/℃
|
46
|
|
Outgassing
(%TML)
|
ASTM E 595
|
%
|
0.02
|
%
|
0.02
|
|
Outgassing
(%CVCM)
|
ASTM E 595
|
%
|
0.01
|
%
|
0.01
|
|
Outgassing
(%WVR)
|
ASTM E 595
|
%
|
0.01
|
%
|
0.01
|
|
Flammability
Rating
|
UL 94
|
|
V-0
|
|
V-0
|
BICEHNG PCB MANUFACTURING PROCESS:
BICHENG TEAM PRACTICE:
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:
