TC350
Rogers RF PCB Built on 30mil Double Sided Corel With Immersion Gold for Tower
Mounted Amplifiers
Rogers'
TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite
for use as making printed circuit board.
Features
& Benefits:
1.
The increased thermal conductivity of TC350 provides higher power handling,
reduces hot-spots and improves device reliability. This results in reduced
junction temperatures and extends the life of active components, which is
critical for improving power amplifier reliability, extending MTBF and reducing
warranty costs.
2.
TC350 has excellent Dielectric Constant Stability across a wide temperature
range. This helps Power Amplifier and Antenna designers maximize gain and
minimize dead bandwidth lost to dielectric constant drift as operating
temperature changes.
3.
TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile
copper. This results in even lower insertion loss due to skin effect losses of
copper that are more obvious at higher RF and microwave frequencies.
Our
PCB Capabilities (TC350):
|
PCB
Material:
|
Woven
Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
|
|
Designation:
|
TC350
|
|
Dielectric constant:
|
3.5±0.05
|
|
Thermal Conductivity
|
0.72 W/m-K
|
|
Dissipation Factor
|
Df .002@10 GHz
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
10mil
(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP, Immersion tin etc..
|
Typical
Applications:
1.
Microwave Combiner and Power Dividers
2.
Power Amplifiers, Filters and Couplers
3.
Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
4.
Thermally Cycled Antennas sensitive to dielectric drift
Typical
Properties of TC350:
|
Typical
Properties:TC350
|
|
Property
|
Units
|
Value
|
Test Merthod
|
|
1. Electrical
Properties
|
|
|
Dielectric
Constant (may vary by thickness)
|
|
|
|
|
@1 MHz
|
－
|
3.50
|
IPC TM-650 2.5.5.3
|
|
@1.8 GHz
|
－
|
3.50
|
RESONANT CAVITY
|
|
@10 GHz
|
－
|
3.50
|
IPC TM-650 2.5.5.5
|
|
Dissipation Factor
|
|
|
|
|
@1 MHz
|
－
|
0.0015
|
IPC TM-650 2.5.5.3
|
|
@1.8 GHz
|
－
|
0.0018
|
RESONANT CAVITY
|
|
@10 GHz
|
－
|
0.0020
|
IPC TM-650 2.5.5.5
|
|
Temperature
Coefficient of Dielectric
|
－
|
|
|
|
TC r @ 10 GHz (-40-150°C)
|
ppm/ºC
|
-9
|
IPC TM-650 2.5.5.5
|
|
Volume
Resistivity
|
|
|
|
|
C96/35/90
|
MΩ-cm
|
7.4x106
|
IPC TM-650 2.5.17.1
|
|
E24/125
|
MΩ-cm
|
1.4x108
|
|
|
Surface Resistivity
|
|
|
|
|
C96/35/90
|
MΩ
|
3.2x107
|
IPC TM-650 2.5.17.1
|
|
E24/125
|
MΩ
|
4.3x108
|
IPC TM-650 2.5.17.1
|
|
Electrical Strength
|
Volts/mil (kV/mm)
|
780 (31)
|
IPC TM-650 2.5.6.2
|
|
Dielectric Breakdown
|
kV
|
40
|
IPC TM-650 2.5.6
|
|
Arc Resistance
|
sec
|
>240
|
IPC TM-650 2.5.1
|
|
2.Thermal
Properties
|
|
|
Decomposition
Temperature (Td)
|
|
|
|
|
Initial
|
°C
|
520
|
IPC TM-650 2.4.24.6
|
|
5%
|
°C
|
567
|
IPC TM-650 2.4.24.6
|
|
T260
|
min
|
>60
|
IPC TM-650 2.4.24.1
|
|
T288
|
min
|
>60
|
IPC TM-650 2.4.24.1
|
|
T300
|
min
|
>60
|
IPC TM-650 2.4.24.1
|
|
Thermal
Expansion, CTE (x,y) 50-150ºC
|
ppm/ºC
|
7, 7
|
IPC TM-650 2.4.41
|
|
Thermal
Expansion, CTE (z) 50-150ºC
|
ppm/ºC
|
12
|
IPC TM-650 2.4.24
|
|
% z-axis
Expansion (50-260ºC)
|
%
|
1.2
|
IPC TM-650 2.4.24
|
|
3. Mechanical
Properties
|
|
|
Peel Strength
to Copper (1 oz/35 micron)
|
|
|
|
|
After Thermal Stress
|
lb/in (N/mm)
|
7 (1.2)
|
IPC TM-650 2.4.8
|
|
At Elevated
Temperatures (150ºC)
|
lb/in (N/mm)
|
9 (1.6)
|
IPC TM-650 2.4.8.2
|
|
After Process Solutions
|
lb/in (N/mm)
|
7 (1.2)
|
IPC TM-650 2.4.8
|
|
Young’s
Modulus
|
kpsi (MPa)
|
|
IPC TM-650 2.4.18.3
|
|
Flexural
Strength (Machine/Cross)
|
kpsi (MPa)
|
14/10 (97/69)
|
IPC TM-650 2.4.4
|
|
Tensile
Strength (Machine/Cross)
|
kpsi (MPa)
|
11/8 (76/55)
|
IPC TM-650 2.4.18.3
|
|
Compressive
Modulus
|
kpsi (MPa)
|
|
ASTM D-3410
|
|
Poisson’s
Ratio
|
－
|
|
ASTM D-3039
|
|
4. Physical
Properties
|
|
|
Water
Absorption
|
%
|
0.05
|
IPC TM-650 2.6.2.1
|
|
Density,
ambient 23ºC
|
g/cm3
|
2.30
|
ASTM D792 Method A
|
|
Thermal
Conductivity
|
W/mK
|
0.72
|
ASTMD5470
|
|
Specific Heat
|
J/gK
|
0.90
|
ASTM D5470
|
|
Flammability
|
class
|
V0
|
UL-94
|
|
NASA
Outgassing, 125ºC, ≤10- 6 torr
|
|
|
|
|
Total Mass
Loss
|
%
|
0.02
|
NASA SP-R-0022A
|
|
Collected
Volatiles
|
%
|
0.01
|
NASA SP-R-0022A
|
|
Water Vapor
Recovered
|
%
|
0.01
|
NASA SP-R-0022A
|
PCB MANUFACTURING PROCESS:
BICHENG PCB WORKSHOP:
BICHENG PCB CERTIFICATE:
BICHENG MAIN COURIERS:
