Thick Film Conductor Paste Used Silver Flake Powder

Spec for the silve flake powder:

Application for silver flake powder:

1. The thick film silver conductor paste into high-temperature sintering sintering peak temperature ≥450 ℃, and low-temperature sintering drying or curing (≤250 ℃). High temperature sintered silver conductor paste usually in ceramics, glass and other heat-conductive substrate to form lines or electrode pads, commonly used in liquid-phase reduction powder; low-temperature drying or curing silver conductor material with an organic polymer as a stick contact phase, comprising a conductive coating, conductive paste, conductive adhesive, since the contact area problem, in order to maximize the advantages of conductive silver, commonly used silver flake and silver light.

2. Bright silver powder and silver flake is obtained by a liquid phase reduction method silver micropowder certain machining, milling is generally (stirred ball mill, a roller ball, ball milling, high energy ball milling, etc.), the nature of the obtained silver powder is dependent on liquid deposition powder, processing and use of additives, thermal decomposition, atomization, evaporation, plasma is typically obtained by condensing the silver powder particle size distribution is broad, even if obtained by precisely controlling the particle size distribution is reasonable, since silver grains having particle partial large, sintering activity is poor, there is a large difference between the surface properties of the liquid phase reduction method, generally not used for thick film conductor paste of conductive filler.